职称:

副教授   博士生导师

 

学术经历:

美国加州大学圣芭芭拉分校 电子与计算机工程系 博士
美国哥伦比亚大学 电子工程系 硕士
华中科技大学 电子科学与技术系 学士

 

个人经历:

官众,博士,高级工程师,广东省高层次人才,中山大学“百人计划”入选者,美国加州大学圣芭芭拉分校电子与计算机工程系博士,博士阶段师从美国EDA领域权威专家、IEEE Life Fellow,Malgorzata Marek-Sadowska教授。在加入中山大学前,官众博士先任职于长江存储美国硅谷研发中心,担任芯片设计工程师,负责代号为“井冈山”的国产首颗64层NAND存储芯片的研发,其后任职于美国新思科技公司(Synopsys Inc.)总部,任高级工程师,负责EDA软件PTPX的功能研发,Ansys的RedHawk到Synopsys的迁移与整合,以及与主流芯片设计公司(包括Apple、Nvidia以及SK-Hynix等)的技术指导。官众博士在美期间主导了两个芯片可靠性的美国国家级科研项目(分别来自于NSF和SRC),其有关信号线电迁移的论文获得了国际高品质电子设计大会(IEEE ISQED)2016年度最佳论文提名奖,其RC电路电流响应快速仿真算法被美国新思科技公司植入旗舰软件PrimeTime中,成为行业标准算法。

 

研究方向:

基于机器学习、神经网络和AI大模型的芯片后端物理建模与量化仿真,以及相关EDA软件研发。

 

正在招收博士后、博士、硕士研究生,欢迎联系!
欢迎优秀本科生参与科研项目(长期有效)!
 

所获荣誉:

国际高品质电子设计大会(IEEE ISQED)2016年度最佳论文提名奖。

 

科研项目:

《基于级联式PINN的集成电路电迁移可靠性精准建模与快速仿真平台》,国家自然科学基金面上项目,项目负责人(PI),2024-2027。

 

学术活动:

国际会议评审委员会评委(Technical Program Committee):
International Symposium on Quality Electronic Design

国际期刊评委:

  1. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  2. IEEE Transactions on Very Large Scale Integration Systems
  3. IEEE Journal on Emerging and Selected Topics in Circuits and Systems
  4. IEEE Embedded Systems Letters
  5. IEEE Transactions on Circuits and Systems I: Regular Papers
  6. IEEE Transactions on Circuits and Systems II: Express Briefs
  7. IEEE Transactions on Circuits and Systems for Video Technology
  8. ACM Transactions on Design Automation of Electronic Systems
  9. Circuits, Systems, and Signal Processing, Springer
  10. Journal of Computational Electronics, Springer

 

学术著作:

  1. Z. Wu, C. Luo and Z. Guan, “A Dynamic Capacitance Matching (DCM)-based Current Response Algorithm for Signal Line RC Network,” IEEE Transactions on Circuits and Systems I: Regular Papers (accepted), 2024.
  2. P. Li, Z. Guan, “Parasitic Capacitance Patterns Grid Density Binarization and Shifted Reflection Step Sequence Encoding for Dimensionality Reduction,” IEEE International Symposium on Quality Electronic Design (ISQED), April 2024.
  3. W. Guan, K. Yang, Y. Chen, S. Liao and Z. Guan, “A Dimension-Augmented Physics-Informed Neural Network (Dapinn) with High Level Accuracy and Efficiency,” Journal of Computational Physics, Vol. 491, pp. 112360, 2023.
  4. Z. Guan, “EM-Aware Memory Mapping Algorithms for SRAM Based FPGA,” IEEE International Symposium on Field-Programmable Custom Computing Machine (FCCM), May 2018.
  5. Z. Guan, M. Marek-Sadowska, “An Efficient and Accurate Algorithm for Computing RC Current Response with Applications to EM Reliability Evaluation,” ACM & IEEE International Conference on Computer Aided Design (ICCAD), Nov. 2016.
  6. Z. Guan, M. Marek-Sadowska, “Incorporating Process Variations into SRAM Electromigration Reliability Assessment Using Atomic Flux Divergence,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 24, no. 6, pp. 2195-2207, 2016.
  7. Z. Guan, M. Marek-Sadowska, “AFD-based Model of EM Lifetime and Reservoir Effect,” IEEE International Interconnect Technology Conference (IITC), May 2016.
  8. Z. Guan, M. Marek-Sadowska, “AFD-Based Method for Signal Line EM Reliability Evaluation,” IEEE International Symposium on Quality Electronic Design (ISQED), March 2016 (Nominated as Best Paper).
  9. Z. Guan, M. Marek-Sadowska, “Atomic Flux Divergence-Based AC Electromigration Model for Signal Line Reliability Assessment,” IEEE Electronic Components and Technology Conference (ECTC), May 2015.
  10. Z. Guan, M. Marek-Sadowska, S. Nassif and Baozhen Li, "Atomic Flux Divergence Based Current Conversion Scheme for Signal Line Electromigration Reliability Assessment," IEEE International Interconnect Technology Conference (IITC), May 2014.
  11. Z. Guan, M. Marek-Sadowska, S. Nassif, “Statistical Analysis of Process Variation Induced SRAM Electromigration Degradation”, IEEE International Symposium on Quality Electronic Design (ISQED), March 2014.
  12. Z. Guan, M. Marek-Sadowska, S. Nassif, “SRAM Electromigration Bit-line Mechanism and its Prevention Scheme”, IEEE International Symposium on Quality Electronic Design (ISQED), March 2013.

 

联系邮箱:

guanzh23@mail.sysu.edu.cn